Semiconductor / Chips
Semiconductor Equipment Corporation
5154 Goldman Ave, Moorpark, CA 93021, United States
- Manufacturer
- Founded 1975
About Semiconductor Equipment Corporation
Semiconductor Equipment Corporation (SEC) was founded in 1975 in Moorpark, California, north of Los Angeles. The company began as a designer and manufacturer of back-end manual equipment for the semiconductor and related industries. SEC designs and manufactures manual and semi-automatic systems for assembly, rework, handling, and test, including die bonders, die handling systems, rework platforms, test equipment, pick-and-place systems, wafer and die tape, and tape-mounting equipment. The company also serves as an authorized distributor for Nitto Denko (dicing and back-grinding tapes, wafer mounters) and Hugle International (container cleaning systems). Operating from a purpose-built manufacturing facility in Moorpark, SEC has installed thousands of systems worldwide since 1975. SEC serves the photonics, semiconductor, hybrid, and printed circuit industries. Its equipment supports packaging and assembly operations for edge-emitting lasers, flip-chip devices, surface-mount technology, and high-reliability packages such as ball grid arrays (BGAs), quad flat packs (QFPs), and multichip modules (MCMs). Customers include semiconductor manufacturers and electronics packaging operations worldwide. The company emphasizes precision, reliability, and manufacturing efficiency, with a focus on custom prototype equipment and application-specific solutions developed through close collaboration with technology innovators. SEC differentiates itself by servicing all equipment it sells, offering live demonstrations in its demo room, and providing on-site training and support.
Manufacturing capabilities
Industries served
- Semiconductor
- Photonics
- Hybrid microelectronics
- Printed circuit
- Electronics packaging
- Display manufacturing
- Precision substrate manufacturing
Equipment
- Model 865 Die Bonder
- REVALPHA® heat-release tape
- Nitto Denko wafer mounters and de-mounters
- Hugle container cleaning systems
Company details
- Location
- Moorpark, California
- Company type
- Manufacturer
- Founded
- 1975
- Listed under
Frequently asked questions
Where is Semiconductor Equipment Corporation located?
Semiconductor Equipment Corporation is located at 5154 Goldman Ave, Moorpark, CA 93021, United States.
What does Semiconductor Equipment Corporation do?
Semiconductor Equipment Corporation is listed under Semiconductor / Chips, and its listed capabilities and products include Manual and semi-automatic equipment design and manufacture, Die bonding, Die handling systems, Rework platforms, Test equipment manufacturing and Pick-and-place systems.
What industries does Semiconductor Equipment Corporation serve?
Semiconductor Equipment Corporation lists Semiconductor, Photonics, Hybrid microelectronics, Printed circuit and Electronics packaging among the industries it serves.
When was Semiconductor Equipment Corporation founded?
Semiconductor Equipment Corporation was founded in 1975.
How do I request a quote from Semiconductor Equipment Corporation?
Use the Request a quote button on this page to send Semiconductor Equipment Corporation your requirements through FirmsLedger, or call (805) 529-2293 and visit semicorp.com.
What companies are similar to Semiconductor Equipment Corporation?
Other Semiconductor / Chips companies in California listed on FirmsLedger include Comchip Technology, Anchor Semiconductor and Surface Mount Solutions.