Semiconductor Packaging
Tezzaron Semiconductor Corporation
1415 Bond St Ste 111, Naperville, IL 60563, United States
About Tezzaron Semiconductor Corporation
Tezzaron Semiconductor Corporation is headquartered in Naperville, Illinois. The company entered the spotlight in 2004 when it demonstrated the world's first successful wafer-stacked 3D integrated circuits with through-silicon interconnects, including microprocessors, sensors, and SRAM devices. While the exact founding year and ownership structure are not publicly disclosed, the firm has since collaborated with dozens of customers to develop custom 3D-ICs for both prototyping and commercial production. Tezzaron's core offering is its Di3D technology, a transistor-level 3D integration platform that combines wafer bonding, proprietary SuperContacts®, dis-integrated architectures, and BiSTAR® programmable self-test. The company handles the full development flow: adapting design tools, rewriting floor-planning rules, inventing and fabricating new structures, and creating novel test techniques and circuits. This end-to-end capability enables high-density, high-speed vertical interconnects in a footprint the size of a single die. The technology targets high-performance semiconductor applications, including microprocessors, sensors, and memory devices. Tezzaron has participated in multiple multi-project wafer (MPW) runs for 3D-IC prototypes, partnering with organizations such as CMP (Circuits Multi Projets) in France. Its customer base spans companies seeking custom 3D-IC solutions for prototyping and volume commercialization. The company states that its approach "changes everything" about 3D integration, aiming to build a Di3D™ ecosystem of partners and licensees where the high-performance world can raise the bar for density and speed.
Manufacturing capabilities
Core processes
Inspection & quality
Assembly & services
Industries served
- Semiconductor
- High-performance computing
- Microprocessors
- Sensors
- Memory (SRAM)
- 3D integration
Materials
Silicon wafers
Company details
- Location
- Naperville, Illinois
- Company type
- Contract manufacturer / job shop
Frequently asked questions
Where is Tezzaron Semiconductor Corporation located?
Tezzaron Semiconductor Corporation is located at 1415 Bond St Ste 111, Naperville, IL 60563, United States.
What does Tezzaron Semiconductor Corporation do?
Tezzaron Semiconductor Corporation is listed under Semiconductor Packaging, and its listed capabilities and products include Wafer bonding, 3D-IC design and floor-planning, Custom 3D-IC prototyping, Multi-project wafer (MPW) participation, BiSTAR® programmable self-test implementation and SuperContacts® fabrication.
What industries does Tezzaron Semiconductor Corporation serve?
Tezzaron Semiconductor Corporation lists Semiconductor, High-performance computing, Microprocessors, Sensors and Memory (SRAM) among the industries it serves.
How do I request a quote from Tezzaron Semiconductor Corporation?
Use the Request a quote button on this page to send Tezzaron Semiconductor Corporation your requirements through FirmsLedger, or call (630) 505-0404 and visit tezzaron.com.
What companies are similar to Tezzaron Semiconductor Corporation?
Other Semiconductor Packaging companies in Illinois listed on FirmsLedger include Industrial Semiconductor, Inc., Bell Semiconductor and EPIR Technologies.