Crossfire Technologies Inc

About Crossfire Technologies Inc

Crossfire Technologies Inc is headquartered in St. Paul, Minnesota. The company focuses on developing chiplet interconnect solutions for AI infrastructure. Crossfire’s product portfolio centers on three core technologies: Bridgelet, Direct Chiplet Input/Output (DCIO), and OmniDie. Bridgelets serve as an alternative to silicon interposers, providing chiplet-to-chiplet connectivity in passive or active forms compatible with industry-standard die-to-die PHYs such as UCIe, BoW, and Ultra Short Reach SerDes. DCIO streamlines the die-to-die interface by removing unnecessary ESD protection, large pads, and overpowered drivers, delivering a protocol-agnostic PHY that supports standard link layers. OmniDie enables the physical integration of multiple chiplets into a single ‘SuperChip’ that mounts directly onto a package substrate, reducing reliance on advanced packaging. Its solutions are positioned for applications requiring disaggregated I/O, memory functions, and heterogeneous integration across product families. Crossfire states that its Bridgelet approach eliminates the cost, complexity, and availability constraints of traditional interposers, claiming up to 50× smaller footprint, 10× lower energy per bit, and 10× lower upfront cost. DCIO is said to achieve 10× lower power, 10× lower cost, and 10× higher density compared to competing solutions.

Company details

Location

St Paul, Minnesota

Company type

Manufacturer

Listed under

• Electronics & Semiconductor Manufacturers in Minnesota

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