Heisler Semiconductor LLC

About Heisler Semiconductor LLC

Heisler Semiconductor LLC operates an advanced packaging and process development lab in Halethorpe, Maryland. The company was established as a US-based, engineering-led team focused on taking hard assembly and wafer-level processes from design review through qualified volume production. The lab provides a full suite of advanced packaging services under one roof, including die attach, wire bonding, flip chip, hermetic sealing, wafer-level processing (lithography, TSV, deposition, etch, CMP, RDL), laser micromachining (micro-vias, dicing, singulation, marking), and comprehensive inspection and metrology (X-ray, 3D AOI, SEM, sub-micron metrology, cross-section failure analysis). The same engineering team handles circuit and hardware design, firmware development, and supply chain coordination, supporting builds from prototype through volume-qualified lots. Equipment includes BESI Datacon and Tresky die bonders, Keyence microscopy, Creative Electron X-ray inspection, and UV/IR laser systems. Heisler serves high-reliability sectors such as aerospace and defense, medical and bio, RF/mmWave (including GaN and CMOS mixed-signal), and advanced sensors (fine-pitch, multi-die, 3D integration). Customers are typically companies building hardware where die placement within microns, thermal cycling survival, and first-lot qualification are critical. The company differentiates itself with a data-driven, AI-native approach: designed experiments (DOE) replace trial-and-error, statistical process control and aggregated build data drive decisions, and AI surfaces drift and correlations to reduce iterations. All development and build work remains on US soil with a domestic supply chain, and detailed design rules and process data are shared under NDA.

Equipment

• BESI Datacon die bonder
• Tresky precision die attach
• Keyence microscopy and metrology
• Creative Electron X-ray inspection
• UV 355nm laser micromachining
• IR 1064nm laser micromachining
• 3D AOI
• SEM
• Sub-micron metrology
• Cross-section failure analysis

Company details

Location

Arbutus, Maryland

Company type

Manufacturer

Production volume

Prototype to volume

Tolerances

±2.5 µm at 3σ on BESI Datacon and Tresky platforms

Certifications

MIL-STD

Listed under

• Semiconductor Packaging in Maryland
• Electronics & Semiconductor Manufacturers in Maryland

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